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QuickPack - Technical Notes
Tech notes - 3
High volume low cost of QuickPack/PowerAct transducers for acoustical/strain actuation applications
Integration Requirements:
Mide has evaluated various methods for integrating QuickPack piezoelectric transducers into OEM products for acoustical and other strain actuation applications. This document describes an example of a high volume/low cost process that can provide OEMs with a reliable method of bonding. This high volume/low cost integration process was originally developed for a QuickPack QP15N to be bonded to a plastic panel with a minimum fixture time of 30 seconds.
Multiple adhesives were evaluated from different suppliers to determine which adhesive would best meet the needs of this application. These adhesives were checked for cure time, bond strength, thermal shock resistance, and hardness. After rigorous testing Mide determined that LoctiteŽ498, an ethyl modified cyanoacrylate, was the best adhesive1.
High Volume Bonding Procedure:
The described integration process is capable of producing 2,500 assemblies in an 8 hour shift utilizing one operator. The only operator intervention will be to load and unload individual plastic panels and to stock bulk QuickPack transducer components into a stacking elevator. The system can be fully automated to eliminate the need for an operator.
Figure 1. Bonding Process: An 8-position rotary indexed table transports parts through station 1 through 8.
Station 1:
Operator loads plastic panels into a fixture nest of rotary center precision indexer. Indexer includes:
- eight position, 32” positive-locking rotary indexable table
- panel holding fixtures/nests at each of 8 positions
- two point doweling for mounting of fixtures
- welded base with heavy-duty locking casters and tote bins
- pneumatic based control system
Station 2:
Dispense adhesive onto panel. Adjustable dispensing valves are set to dispense precise and repeatable beads of adhesive to specified location on panel. Adhesive dispensing station includes:
- fixturing for dual adhesive dispenser
- X,Z dispensing motion controller with pneumatic control system/interface to indexing dial
- pressure sensor
- external controls to adjust dispensing valve pressure and time
Station 3:
Pick and place QuickPack transducer onto adhesive QuickPack transducers are available from a part feeder and stack elevator. A vacuum based pick and place mechanism will provide accurate placement (+/- 0.015”) of the transducer onto the panel.
An automatic mechanical clamp will apply force onto the transducer and maintain adequate adhesive fixturing pressure as the assembly rotates through stations 4-7
Stations 4-7:
Adhesive cure. Assembly rotates through 4 stations for curing. No processes are performed on the assembly.
Station 8:
Unclamp and prepare for unload. An automatic unclamping device will free the transducer/panel assembly and prepare for unloading at Station 1
Station 1:
Unload bonded transducer/panel assembly. Operator unloads assembly and prepares to load next panel.
Mide can work with customers to modify this process for unique product and integration requirements.
For more information:
Please email Conor Clery (Products), or call: 781-306-0609 x292
